EMI FILM SPECIAL COATING MACHINE is special for mobile, laptops, telephone, DVD and other plastic shells of electronic products to get a EMI shielding film. It's using plasma treatment technique, vacuum evaporation and magnetron sputtering technique together, to evaporate Ag, Cu, then deposit Ni/Cr/Stainless steel coating by sputtering technique, it can deposit EMI coatings of different resistance requirements.
Characteristics and basic parameters:
1.The machine has both horizontal and verical structure, while single-sided coating can be realized
2.Production efficiency, the fastest speed is up to 1 minute/cycle
3.Modular design, easy to maintain
4.Deposition process maturity, high yield
5.DC magnetron sputtering cathode can be selected by customer
6.Vacuum system consists of mechanical pumps, roots pumps, dffusion pump
7.Maximum size:2200mm*1200mm(L*W)
8.Minimum size:500mm*400mm(L*W)
| Chamber size | Φ400×500mm | Φ1200×2200mm |
| Input power | 3 phase 5 wires 380V 50Hz/60Hz | |
| Pumping time | Atmosphere to 5.0×10-2Pa≤7min | |
| Ultimate vacuum | 10-4Pa | |
| Rotation | 5～30r/min | |
| Norminal power | 78KW/100KW | |
| Vacuum system | Roots pump+ mechanical pump + diffusion pump/molecular pump + holding pump+ polycold | |
| Ambient temperature | 5～40℃ | |
| Compressed air | 0.5MPa±20% | |
| Cooling water pressure | 0.15MPa±10% | |
| Control system | HMI/PLC | |
| Coating system | 30KVA evaporation power/40KVA evaporation power | |
Coat electromagnetic shielding (EMI) film on the surface of mobile phones, laptops, telephones, DVD and other electronic products plastic shell.
